Solve PCB heat dissipation techniques and methods

Many friends are inevitably trying to solve the problem of heat dissipation on pcb when designing pcb. The heat generated during the operation of the electronic device causes the internal temperature of the device to rise rapidly. If the heat is not dissipated in time, the device will continue to heat up and the device will fail due to overheating, and the reliability of the electronic device will decrease. Therefore, it is very important to dispose the circuit board. The last time a friend of intelligent hardware innovation and entrepreneurship had been tangling pcb thermal problems, the temperature difference between the machine and the shell was quite large. They have been unable to solve, affecting the progress of their product mass production, which needs to solve the problem of pcb heat dissipation.

The direct cause of PCB temperature rise is due to the existence of circuit power devices, electronic devices have varying degrees of power consumption, heat intensity varies with the size of power consumption.

Two phenomena of temperature rise in printed board:

(1) local temperature rise or large area temperature rise;

(2) Short-term temperature rise or long-term temperature rise.

In the analysis of PCB thermal power consumption, the general analysis from the following aspects.

1, electric power consumption

(1) Analyze power consumption per unit area;

(2) Analyze the distribution of power consumption on the PCB.

2, the structure of the printed board

(1) The size of the printed board;

(2) The material of the printed board.

3, the installation of printed boards

(1) Installation method (such as vertical installation, horizontal installation);

(2) Sealing conditions and distance from the casing.

4, heat radiation

(1) The emissivity of the printed board surface;

(2) The temperature difference between the printed board and the adjacent surface and their absolute temperature;

5, heat conduction

(1) Install a radiator;

(2) Conduction of other mounting structures.

6, thermal convection

(1) natural convection;

(2) Forced cooling convection.

The analysis of the above factors from the PCB is an effective way to solve the temperature rise of the PCB. Often these factors are related and dependent on one product and system. Most of the factors should be analyzed according to the actual situation, only for a specific The actual situation can be calculated or estimated more correctly temperature rise and power consumption and other parameters.