Taiwan's long-established LED epitaxy plant has a new blue ocean layout, and officially entered advanced (comprehensive COB and F / C) LED packaging in the second half of this year. Guanglei pointed out that in the fourth quarter of this year, LED packaged components can be mass-produced and shipped. The new Ningbo plant that will be completed will focus on manufacturing LED lighting packaged components.
Optoelectronics stepped into the new layout strategy of packaging from Epitaxy. The duck has been laid out for 3 years. After a careful evaluation, it has been supported by Japanese major shareholders Nichia and Hitachi. Zhang Leiquan, deputy general manager of Guanglei, pointed out that through the 30th anniversary of Guanglei next year, through the vertical integration of LED development, the market layout of Guanglei will be further expanded. Lei still has growth momentum after reaching 30.
LED enters the era of lighting, high-power chips require COB, even F / C grade advanced packaging technology to achieve higher-order cost performance. At present, Taiwan's Lunda is developed by vertical integration, and epitaxial leader Jingdian is through reinvestment. Development, and Guanglei chose to integrate midstream LED packaging directly from upstream LED epitaxy. At present, Guanglei ’s LED packaging has set up an experimental line in the Zhuke plant and will officially send samples to LED lighting customers in the fourth quarter of this year. .
Guanglei Ningbo's new factory originally planned to develop an LED epitaxial factory in 2008, but it was stopped due to the financial turmoil. When it restarted last year and resumed construction, it was designed as an LED packaging plant. It is currently nearing completion and will be completed this year. After the successful delivery of LED packaging in the fourth quarter, the production capacity was gradually increased. Preliminary capacity planning, about a month's shipments reached the level of one million standard LED tube packaging components.
Guanglei initially estimated that the contribution of the new Ningbo plant will not be apparent until the second half of next year. During this period, Taiwan Bamboo Plant will still supply LED packaging components.
Optoelectronics estimates that in the LED lighting market, achieving advanced packaging components from LED die will be more cost-effective in the market; and Optoelectronics' own advanced packaging technology has excellent heat dissipation and not only helps The launch of LED lighting customers with cost-effective lighting products will also lead Optoelectronics out of the industry bottleneck in the development of LED chips with minimal profit.
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