Analysis of the characteristics of common LED chips :
First, the MB chip: Metal BONding (metal adhesion) chip; this chip belongs to the patented product of UEC.
Features:
1: The material with high heat dissipation coefficient, Si, is used as the substrate, and heat dissipation is easy.
2: Wafer bonding of the epitaxial layer and the substrate by a metal layer while reflecting photons to avoid absorption of the substrate.
3: The conductive Si substrate replaces the GaAs substrate and has good thermal conductivity (the thermal conductivity is 3~4 times different), which is more suitable for the high drive current field.
4: Bottom metal reflective layer for luminosity enhancement and heat dissipation
5: Size can be increased, applied to High power field, eg: 42mil MB
Second, GB chip: Glue Bonding (adhesive bonding) chip; this chip belongs to UEC's patented product
Features:
1: A transparent sapphire substrate replaces the light-absorbing GaAs substrate, and its light output power is more than twice that of a conventional AS (Absorbable STructure) chip, and a sapphire substrate is similar to a TS chip.
2: The chip is illuminated on all four sides, with excellent Pattern
3: In terms of brightness, the overall brightness has exceeded the level of the TS chip (8.6mil)
4: Double-electrode structure, its resistance to high current is slightly worse than TS single-electrode chip
Third, the TS chip: transparent structure (transparent substrate) chip, the chip belongs to HP's patented product.
Features:
1: Chip process is complex and much higher than AS LED
2: Excellent reliability
3: Transparent GaP substrate, no absorption of light, high brightness
4: Wide range of applications
Fourth, AS chip: Absorbable structure (absorbent substrate) chip;
After nearly 40 years of development efforts, Taiwan's LED optoelectronics industry is at a mature stage for the research and development, production and sales of this type of chip. The R&D level of major companies in this respect is basically at the same level, and the gap is not big.
The mainland chip manufacturing industry started late, and its brightness and reliability still have a certain gap with the Taiwanese industry. Here we talk about the AS chip, especially the UE chip of the UEC, eg: 712SOL-VR, 709SOL-VR, 712SYM- VR, 709SYM-VR, etc.
Features:
1: Four-element chip, prepared by MOVPE process, brightness is brighter than conventional chip
2: Excellent reliability
3: Wide range of applications
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