Recently, the National Development and Reform Commission issued the No. 1 Order of 2017, promulgating the 2016 edition of the “Guidance Catalogue for Key Products and Services for Strategic Emerging Industriesâ€.
This catalogue covers 8 industries in five major areas of strategic emerging industries (listed separately in related service industries), 174 sub-directions in 40 key directions, and nearly 4,000 sub-products and services.
Among them, the LED industry mainly includes high-end materials, key equipment, and high-efficiency and low-cost LED replacement light sources.
(1) In the instruction list, the materials involved include silicon materials (silicon single crystal, polished sheet, epitaxial wafer, silicon-on-insulator, silicon germanium) and compound semiconductor materials, substrate materials such as sapphire and silicon carbide, metal organic sources and ultra-high Raw materials for epitaxy such as purity gas, high-end LED packaging materials, new high-efficiency phosphors, high-performance ceramic substrates, etc.
In the high-end LED packaging material part, because the traditional epoxy resin (EP) has the disadvantages of easy yellowing, large internal stress and poor thermal stability, it can not meet the packaging requirements of white LED, and is replaced by a silicone material with excellent performance. .
Silicone encapsulants have excellent thermal stability, water resistance and light transmissibility due to their organic and inorganic groups. They have become the focus of research on LED packaging materials at home and abroad; however, organic Silicon still has some disadvantages (such as poor UV aging resistance, low thermal conductivity, etc.). In recent years, researchers at home and abroad have used nanotechnology to modify silicones and have received extensive attention.
As an LED packaging material, the defects of ordinary EP determine that it can not meet the requirements of the use of packaging materials, so the modification of the EP is imperative. The POSS molecule has both a nano-scale inorganic rigid cage structure and a reactive organic functional group, which can introduce inorganic SiO2 particles into the organic polymer chain in the form of covalent bonds, so that the performance of EP is significantly improved. Improve the overall performance of the encapsulant.
Additive silicone materials have good transparency, high temperature resistance, weather resistance, insulation, hydrophobicity and UV radiation resistance. They are ideal packaging materials for white LEDs. In order to improve the refractive index and radiation resistance of the LED packaging material, an appropriate amount of a phenyl group may be added to the silicone molecule. As research continues to deepen, it will certainly be possible to develop additive-forming silicone packaging materials that meet the packaging requirements of LEDs in different environments and applications.
Silicone nanocomposites not only have strong UV shielding rate, high visible light transmittance, high thermal conductivity, low dielectric constant and filling amount, but also have no effect on the mechanical properties and processing properties of the composite. The specificity of nanocomposites has attracted the attention of many experts.
In addition, as an important part of the packaging material, the original relatively wide profit margin of the phosphor material has been squeezed out, and the overall living conditions are becoming increasingly severe. At the same time, increasing packaging requirements and higher technical requirements for phosphor companies pose even greater challenges for phosphor companies.
The most effective and convenient way in the past was to apply yellow (or green) phosphors and red phosphors simultaneously on a blue LED chip. However, the existing red phosphor suitable for blue light excitation is not too low in luminous efficiency or too in stable, and is difficult to be applied to the preparation of high color rendering white LEDs.
At present, the difference in light efficiency between domestic phosphor powder products is not too large, and basically meets the needs of general packaging, but it is still uneven in terms of key performance indicators such as reliability and light color concentration. At the same time, there are still some shortcomings in the patent.
At the same time, the future development of packaging technology will also put forward higher requirements for phosphor performance, including high color rendering, full spectrum, excitation efficiency, light color concentration, high temperature resistance and long-term aging color drift dispersion.
At present, domestic and foreign phosphor companies are working hard on the development of a new generation of phosphor materials.
Through the efforts of the rare earth in the past three years, two kinds of high-efficiency low-light fading red phosphors have been developed, and both of these phosphors have been successfully applied to the preparation of white LEDs with high color rendering and low color temperature.
While improving the sulfide red phosphor, a new type of alkaline earth and transition metal composite oxide red phosphor was successfully developed. This series of phosphors uses trivalent europium as an activator and can be effectively excited by UV, violet or blue LEDs. This series of phosphors is significantly superior to traditional red phosphors in terms of stability and luminous efficiency. The national invention patent has been declared.
Japan's Mitsui Kinzoku has developed a sulphide phosphor material for white LEDs. According to the company, red and green phosphors have been invented, which can be combined with blue LEDs to produce white light, which is different from the traditional method of using blue LEDs to excite oxide phosphors to produce white light.
Japan's Mitsui Mining Smelting Co., Ltd. pointed out that the sulphide phosphor is more pure than the oxide phosphor, and it combines with red and green phosphors to produce purer, natural white light.
(2) involving epitaxial chip links, including light-emitting diodes (LEDs), large-size open boxes, sapphire, silicon carbide and other substrates, high-purity metal organic compounds (MO source), high-purity ammonia gas, etc. Epitaxial equipment such as source chemical vapor deposition equipment (MOCVD), hydride vapor phase epitaxy (HVPE), inductively coupled plasma (ICP) etching machine, large-scale high-efficiency low-cost LED epitaxial growth, chip preparation industrialization technology device.
In recent years, the LED industry has continued to develop larger-sized substrates to reduce costs and increase the production of high-quality LED chips, thereby accelerating the popularity of LED lamps. Last year, Monocrystal introduced an oversized 10-inch C-plane open-box sapphire substrate.
At the same time, the introduction of this catalogue also means that the epitaxial industrialization technology (Epi-ready grade) with sapphire, GaN, SiC and other substrate materials will become an important research and development direction and trend.
In addition, large size, high efficiency and low cost have become the main direction of next-generation LED epitaxial growth and chip preparation industrialization technology. With the current level of research and development of domestic upstream equipment, there is no doubt that overseas mergers and acquisitions will be one of the shortcuts. In the past few years, the localization of MOCVD has not achieved the expected results.
Very few companies have a small amount of domestically produced equipment, but in recent years, with the slowdown in the growth of the LED industry, the cost of equipment is high, and the competitive pressure in the LED market has led to the reshuffle of the industry. In the absence of sufficient digestion of excess capacity in the industry, the market demand for MOCVD equipment is also declining year by year.
At the end of 2016, after Fujian Hongxin acquired Germany's Ai Siqiang, there was a figure of China's integrated circuit industry investment fund, which also highlighted the urgency of localization of key equipment for epitaxial growth. The United States finally rejected the deal on the grounds of national security.
(3) The packaging process involves packaging key equipment, high-efficiency white LED new packaging technology and supporting materials development.
In recent years, the competition for white LED packaging has further intensified, and the decline in gross profit margin has led to further market shuffling and washing off a large number of uncompetitive companies. However, as a main light source for lighting applications, white-light packaged devices are increasingly demanding and the application fields are becoming more and more extensive.
With the continuous development of LED power, modularization, low cost, and high reliability, the requirements for packaging technology will become more and more demanding, especially for packaging materials and packaging processes. Packaging technology is more complex, and needs to consider optical, thermal, electrical, structural and other factors, while low thermal resistance, stable packaging materials and novel and excellent packaging structure are still the key to LED packaging technology.
(4) Involving lighting links, including high-efficiency low-cost downlights, spotlights, street lights, tunnel lights, bulbs, and other alternative semiconductor lighting sources, new LED lighting applications, semiconductor lighting inspection technology and standard system construction, semiconductor lighting inspection Equipment development and testing platform construction.
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