It is estimated that there are now billions of smartphones from our smartphones to other "portable" communication mobile devices on our planet, and that this number will only increase in the future. Today's consumers can hardly imagine the days when they could not use mobile devices all day long. Whether it's sending emails to colleagues, getting directions to restaurants, watching emergency news broadcasts, or experiencing the Internet for the first time, there's no difference. Mobile devices are one of the most important connections to communicate with the outside world. The chips in these mobile companions play a mediating role in building a personal experience that fully meets the unique needs of consumers.
Due to the emergence of such a market to be explored, equipment manufacturers are constantly looking for semiconductor solutions that can provide a new generation of "killer" equipment at a reasonable price. Vendors use a chip that responds positively to consumer expectations for processing, power, and connectivity. These tiny miracles are embedded on the boards of mobile devices. They are the brains of consumers' favorite devices, and each chip is designed with a unique purpose. Below are some of the components that will enable the various parts of the mobile device to work together, as well as several major trends driving current and future mobile chip designs.
Trend 1: Realizing differentiation with discrete processors
There is no “integrated†solution in the mobile market, and every user wants to get a device that meets their individual needs. True mobile device differentiation depends on the software running on the application processor, which defines the final product. The application processor and modem work together to deliver a great user experience, functionality and applications. The modem can receive signals or data from the antenna, convert the data into a usable format, and send it to the application processor. The application processor helps to achieve an end-user experience, using modem data as data for various experiences such as HD 1080p video decoding, user interface graphics rendering, and Internet browsing comparable to PCs. Discrete application processor solutions with modems and application processors on separate chips help mobile device manufacturers expand software quickly and efficiently, enabling unique features that meet the needs of various markets. In contrast, integrated solutions that integrate modems and application processors in a unified package often require compromise and sacrifice in terms of innovation and time to market.
There are many reasons to separate the modem and application processor functions, including the speed of technology development and the time-to-market between generations of modems and application processors. As processor design and mobile device PCB design have become more convenient, the time to market for discrete application processors is now six to 12 months faster than the time to market for integrated modem/application processor designs. In fact, independent “thin modems†can more easily accelerate the time-to-market of innovative products compared to integrated solutions. In addition, because of the huge differences in the speed of innovation, independent solutions can be used to switch between different versions more efficiently.
In addition to the differences in time, discrete application processors have development and design advantages. For example, discrete processors enable the open source community to bring device manufacturers the benefits of collaborative software development. In addition, they further improve the voice path for the latest features and higher voice quality.
Trend 2: Advanced processor features, the latest reality
The application processor ensures a faster, more innovative design and supports future expansion investments. In addition, they represent an important trend in the entire mobile product arena: making each product the perfect combination of low power and high performance, rather than relying on it. In short, mobile devices are not good products if the battery is easily exhausted and the weight/size is seriously conflicted with the battery size. Similarly, product differentiation requires ample performance space in the product line. Using discrete application processors as the core of the design, manufacturers have the flexibility to meet the power and performance needs of a wide range of products.
The best balance between power and performance continues to revolutionize the portable experience, and next-generation application processors will soon implement features such as contactless gestures, 3D HD video, and video. The new mobile operations brought about by human-computer interaction (HDI) will also revolutionize the way consumers and devices connect with the outside world. HDI is a set of technologies that improve the way people interact with mobile devices in a natural and intuitive way. For example, a standard 2D camera will track and recognize body movements and gestures on the device, and gestures will convert touch commands into non-contact interactions.
With powerful processing power, stereo video and image enhancements will also change the way we capture and view content. Daily 2D images will be converted to interactive 3D HD memory. By projecting mobile content on any plane, information sharing will transform from a one-on-one experience to a one-to-many experience, while traditional phones will transform into a data center through face, logo, and object recognition. Future application processors can transform these functions from pure design ideas into real-world experiences, changing the way users “live†their lives.
Trend 3: Integrated connectivity technology enables strong connectivity to the outside world
Similar to the low power consumption and high performance demanded by consumers, the connectivity of mobile devices is becoming a hot spot. Bluetooth, GPS, FM radio, and mobile wireless LAN technologies provide a richer set of information and a wider range of connections to increase the usability of mobile devices. As with application processors, these connectivity technologies must provide robust functionality at a reasonable price without compromising battery life, reducing cellular service quality, or performance.
But on the other hand, in the mobile world, the discrete approach to connectivity technology cannot be compared to the discrete approach of discrete application processors. In fact, an integrated connectivity solution that integrates one or more mobile radio technologies on a unified chip can continue to deliver value in meeting consumer and manufacturer needs. Multi-radio integration solutions save space, minimize power consumption, and streamline your phone's bill of materials, saving system costs and simplifying manufacturing processes. Today's integrated solutions enable superior connectivity, while next-generation chips can combine up to four technologies on a unified die to further enhance functionality. With multiple connection points, multitasking, sharing and overall communication can reach new heights.
In the design of the integrated solution, various power reduction features are also used, including a complete processor that provides communication flow management, which can handle the entire communication load according to the corresponding connection technology. In addition to being able to communicate with larger systems, these devices can operate without host processor intervention. As a result, the mobile host processor and other functions can enter a low-power mode when the integrated solution handles communication tasks, saving power and extending battery life between charges.
While the integrated solution is extremely valuable, its history has not been smooth for semiconductor engineers. Bluetooth, GPS, WLAN, and FM solutions all require different transmission and reception technologies. Adding one or more of these features to the device requires the collection of parallel communications from the multiplying RF function. Signal interference between different RF technologies, especially Bluetooth and WLAN technologies using the 2.4 GHz band, may also cause difficulties for users, reduce call reliability, and even drop lines. In view of these and other factors, providers face many challenges in creating devices that enable RF connections for multiple communication tasks to run successfully on a unified silicon chip. Sharing the same antenna between different technologies exacerbates these conflicts and increases the need for enhanced designs.
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