Qualcomm has made significant strides in the 3D sensing market and is set to begin mass production by the end of the year. This breakthrough technology is expected to find widespread use in Android smartphones next year, with potential applications extending to drones and the automotive sector in the long term. Additionally, Qualcomm's ultrasonic fingerprint recognition technology is designed to align with the current trend of full-screen panels in mobile devices, with consumer-ready products anticipated by the end of this year or early next year.
This advancement is supported by compelling imagery, showing how Qualcomm’s 3D sensing technology and ultrasonic fingerprint recognition could soon become standard features in Android smartphones. The accompanying image highlights the integration of these technologies, which are poised to enhance face recognition capabilities.
Apple’s introduction of 3D sensing technology in the iPhone 8, leveraging partnerships with companies like STMicroelectronics and utilizing TSMC for production, has spurred global interest in similar innovations. Industry insiders report that Apple's 3D sensors have already begun mass production in the third quarter.
Zhang Jianzhong, Qualcomm's Vice President of Engineering, emphasized the company's focus on face recognition using structured light technology. This involves projecting non-infrared light onto objects, capturing the reflected light through lenses, and processing the data via Qualcomm's proprietary algorithms to render the object in 3D. Qualcomm remains optimistic about the potential of 3D sensors in face recognition due to the vast number of facial features, which make it more efficient compared to fingerprint recognition.
Looking ahead, Zhang Jianzhong envisions integrating 3D sensors into wearable devices like glasses. For instance, users entering a dark room could benefit from invisible light scanning, projecting images onto their glasses for safe navigation even in complete darkness.
In terms of manufacturing, Qualcomm is collaborating with partners including Qijing for optics and algorithms, TSMC for wafer fabrication, and fine materials for packaging and testing to ensure seamless mass production by year-end.
On the biometric front, Qualcomm has also developed an advanced ultrasonic fingerprint recognition solution. Unlike traditional capacitive solutions, ultrasonic recognition works effectively even when fingers are wet or greasy, offering superior security and compatibility with full-screen designs. This technology has already been shared with leading Chinese smartphone brands like Huawei, OPPO, and Vivo, with Vivo confirming its adoption. Consumers can expect these cutting-edge solutions to hit the market by the end of this year or early next year.
These developments underscore Qualcomm's commitment to innovation, positioning itself at the forefront of technological progress in both biometrics and imaging.
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