Qualcomm has made significant strides in the 3D sensing market and plans to kick off mass production by the end of this year. This technology is expected to find widespread adoption in Android smartphones next year, with potential expansion into industries like drones and automobiles down the road. Additionally, Qualcomm’s ultrasonic fingerprint recognition technology aims to align with the current trend of full-screen panel designs, with terminal products anticipated to hit the market by the end of this year or early next year. Accompanying this advancement, a recent image highlights how Qualcomm's 3D sensing technology and ultrasonic fingerprint recognition could soon become standard features on Android devices.
Industry insiders report that Apple’s upcoming iPhone 8 will feature 3D sensing technology to support advanced facial recognition, sparking a race among global tech giants to innovate in this field. Sources indicate that Apple’s 3D sensors are being produced in collaboration with major firms such as STMicroelectronics, with TSMC handling the manufacturing and assembly. Mass production reportedly began in the third quarter.
According to Zhang Jianzhong, Qualcomm’s Vice President of Engineering, their 3D sensing technology focuses on facial recognition, utilizing structured light technology. By projecting non-infrared light onto objects and capturing the reflected light through lenses, the system recognizes depth and renders objects in 3D using proprietary algorithms. Zhang expressed optimism about the potential applications of 3D sensor cameras in facial recognition due to the vast number of unique facial features. Compared to fingerprint recognition, which requires scanning multiple fingers, facial recognition offers a quicker and more efficient alternative. He envisions future applications in fields like security, automotive, robotics, and virtual reality.
Zhang further noted that the 3D sensor camera could eventually be integrated into wearable devices such as glasses. For instance, users could enter a dark room and use invisible light to scan the environment, projecting the image onto their glasses for safe navigation in pitch-black conditions.
Qualcomm is collaborating with partners like Qijing, TSMC, and others to bring 3D sensing technology to mass production by year-end. Qijing handles optical components and algorithms, while TSMC provides wafer fabrication services for sensors and chips. TSMC also manages wafer-level packaging and testing.
In addition to these innovations, Qualcomm is rolling out an ultrasonic fingerprint recognition solution. Zhang emphasized that ultrasonic fingerprint recognition excels in accuracy, regardless of moisture or grease on the finger. Its security surpasses capacitive solutions and allows integration beneath the phone’s glass surface, aligning perfectly with the current trend toward full-screen designs. Qualcomm has already shared its ultrasonic fingerprint identification solution with major Chinese smartphone brands such as Huawei, OPPO, and Vivo. Vivo has confirmed its intent to adopt this technology, with consumer-ready products expected by the end of this year or early next year.
These advancements underscore Qualcomm’s commitment to pushing boundaries in mobile technology, ensuring enhanced security and user experience across various sectors.
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