2008 semiconductor equipment global market dropped by 27.7%


The International Semiconductor Equipment and Materials Association (SEMI) announced at a press conference on December 2, 2008 at the opening of SEMICON JAPAN 2008 that the global market for semiconductor manufacturing equipment in 2008 is forecast to decrease by 27.7% over the previous year. $300.1 billion.

Stanley T. Myers, President and CEO of SEMI, said: 2008 is the lowest level since 2003. There will also be double-digit negative growth in 2009. However, if the original industry development model is followed in 2010, demand should be restored. SEMI forecasts that the market size in 2009 was 24.2 billion US dollars, a decrease of 21.4% from 2008, and 2010 was 31.77 billion US dollars, an increase of 30.8% over 2009.

According to the type of equipment, the sales in 2008 are expected to be 28.2 billion US dollars lower than the previous year. According to SEMI, assembly and packaging equipment decreased by 23.8% year-on-year to $2.16 billion, and test equipment decreased by 27.1% to $3.69 billion.

By region, the market in Taiwan has dropped significantly. Although the Taiwan region surpassed Japan to become the world's largest market in 2007, it is expected that the market size in Taiwan will decrease by 47.5% in 2008 from the previous year, falling to 5.59 billion US dollars, once again giving the market share the number one throne to Japan. . The Japanese market was $7.42 billion, a decrease of 20.4% from the previous year.

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